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              Cree 又名:科銳

              目錄
              Cree 公司是市場上領(lǐng)先的革新者與半導(dǎo)體的制造商,以顯著地提高固態(tài)照明,電力及通訊產(chǎn)品的能源效果來提高它們的價(jià)值。

              Cree

              Cree 公司是市場上領(lǐng)先的革新者與半導(dǎo)體的制造商,以顯著地提高固態(tài)照明,電力及通訊產(chǎn)品的能源效果來提高它們的價(jià)值。

              Cree 的市場優(yōu)勢關(guān)鍵來源于我們在有氮化鎵(GaN) 的碳化硅 (SiC) 方面上獨(dú)一的材料專長知識,來制造芯片及成套的器件。這些芯片及成套的器件可在很小的空間里用更大的功率,同時(shí)比別的現(xiàn)有技術(shù),材料及產(chǎn)品放熱更少。

              Cree 把能源回歸解決方案 (ROE™) 用于多種用途,包括在更亮及可調(diào)節(jié)的發(fā)光二極管光一般照明,更鮮艷的背光顯示,高電流開關(guān)電源和變轉(zhuǎn)速電動(dòng)機(jī)的最佳電力管理,和更為有效的數(shù)據(jù)與聲音通訊的無線基礎(chǔ)設(shè)施等方面有令人興奮的可選擇的方案 。 Cree 的顧客有從創(chuàng)新照明燈具制造商到與國防有關(guān)的聯(lián)邦機(jī)構(gòu)。

              Cree 的產(chǎn)品系列包括藍(lán)的和綠的發(fā)光二極管芯片,照明發(fā)光二極管,背光發(fā)光二極管,為功率開關(guān)器件,無線電頻率設(shè)備和無線電設(shè)備的發(fā)光二極管。 

              Cree 歷程

              Major Business and Product Milestones

              1980s
              July 1987 Cree founded
              August 1989 Introduced first blue LED
              1990s
              October 1991 Released world’s first commercial SiC wafers
              February 1993 Initial public offering
              August 1993 Introduced 4H SiC wafer
              September 1993 Introduced brighter version blue LED
              October 1993 Developed SiC microwave transistors operating up to 12.9 GHz
              June 1995 Introduced Nitride-based blue LED
              May 1997 Announced reduced micropipe 4 HN SiC wafers
              June 1997 Demonstrated pulsed GaN blue laser at room temperature
              September 1997 Introduced 2-inch SiC wafer
              March 1998 Demonstrated high-power microwave SiC MESFET
              May 1999 Introduced InGaN blue and green LEDs
              June 1999 Introduced 48 V, 10 W SiC MESFET RF device
              October 1999 Demonstrated 4-inch SiC wafer
              2000
              May Demonstrated 12.3 kV high-efficiency SiC power rectifier
              June Introduced lower-current InGaN blue and green LEDs
              August Announced high-power 10 GHz GaN HEMT
              October Introduced UltraBright® blue and green LEDs
              2001
              February Demonstrated 32-percent quantum efficiency with near-UV LED
              April Introduced 3-inch 4H SiC wafers
              May Introduced MegaBright® blue LED
              July Introduced 4H and 6H 3-inch SiC wafers
              July Introduced first SiC Schottky diodes
              July Introduced 12 mW UV LEDs
              October Introduced XBright® blue LED
              November Introduced green 505 MegaBright LED
              November Announced blue laser lifetimes in excess of 1,000 hours
              December Demonstrated 108 W at 2 GHz from GaN RF devices
              2002
              January Introduced 10-A, 600-V, SiC Schottky rectifier
              January Introduced green 525 MegaBright LED
              February Introduced XBright power chip
              August Introduced 20-A, 600-V, Zero Recovery® SiC rectifier
              2003
              February Released 1200 V SiC Schottky rectifier
              March Introduced second-generation SiC MESFET RF transistor
              June Introduced MegaBright Plus™ and XBright Plus™ blue LEDs
              June Introduced LDMOS products for avionics and radar markets
              June Demonstrated 100 mm semi-insulating SiC substrates
              July Introduced RazerThin® LED products
              2004
              January Expanded XThin® LED product family
              May Launched brighter XThin LED product
              July Launched XLamp® LED product line
              November Announced XLamp 7090
              2005
              February Achieved standard LED efficiency of 100 lumens/watt in R&D
              February Achieved 56 lumens from one-watt white XLamp LED in R&D
              May Introduced brighter blue and green XB900™ power LEDs for LCD BL
              May Introduced Colorwave™ backlight solution for LCD TVs & monitors
              June Introduced MegaBright 290 Gen 2 LED Product
              June Introduced RazerThin 230 LED product
              June Introduced SiC MESFETS for WiMAX power amplifiers
              July Introduced 3-watt XLamp
              September Achieved 70 lumens per watt with XLamp 7090 LED in R&D
              September Introduced 100mm (4”) SiC substrate and epitaxy material
              2006
              January Demonstrated a 100-kVA SiC Three Phase Inverter
              February Introduced the XR series of XLamp LEDs
              March Introduced the EZBright™ family of LED chips
              April Introduced the EZR™ LED chip for the EZBright family
              May Introduced GaN HEMT for WiMAX power transistors
              June Demonstrated a 131-lumens/watt white LED
              June Demonstrated 400 watts of RF power for GaN S-Band transistors
              July Introduced 2-amp rectifier for PC power supplies
              August Introduced EZBright1000™ LED power chip for general lighting applications
              October Delivered the XLamp XR-E Series LED, the first 160-lumen white power LED
              2007
              February Introduced the XLamp XR-C series of LEDs
              February Introduced the EZBright700 LED power chip
              March Expanded the XLamp XR-E and XR-C series of LEDs with warm white color temperatures
              April Acquired COTCO Luminant Device Ltd. of Hong Kong
              May Demonstrated 100-mm, Zero Micropipe SiC substrates
              June Introduced GaN HEMT for broadband applications
              June Introduced blue XLamp XR-E LEDs
              June Announced commercial availability of XLamp LEDs with minimum luminous flux of 100 lumens at 350 mA
              September Achieved 1,000 lumens from a single LED
              October Introduced 8-A, 600-V, Zero Recovery SiC rectifier for computer servers
              October Announced commercial release of 100-mm, Zero Micropipe SiC substrates
               


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